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Advanced Materials for Thermal Management of Electronic Packaging
by Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
Availability:
Copies available:
AUM Main Library
(1),
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Introduction to Thermoelectricity
by Goldsmid, H. Julian.
Publication:
. XVI, 242 p.
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AUM Main Library
(1),
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Metal-Dielectric Interfaces in Gigascale Electronics
by He, Ming.
Publication:
. XI, 149p. 120 illus., 48 illus. in color.
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AUM Main Library
(1),
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Advanced Thermal Management Materials
by Jiang, Guosheng.
Publication:
. VIII, 156 p. 72 illus., 29 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
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